IM-B20 – KU060

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Additional information

FPGA DeviceDevice: KU060
Package: A1156
Speed Grade: -2
Temperature Grade: E
Module FlavorMax Memory: No
Max Differential: No
Balanced:
Module InterposerGTY - 25 Gbps / line:
GTH - 16 Gbps / line: 28x GTH
RF ADC 14 bits - 5 GSPS / line:
RF DAC 14 bits - 10 GSPS / line:
SD-FEC:
HP & HR Diff. Pairs @1,2Gbps: 14x Diff. IO
HP & HR incl Differential General Clocks: incl. 7x Clock
HP & HR - IO lines single ended: 169x GPIO
HD-IO GPIO lines @0,6 Gbps:
HD-IO incl Differential General Clocks:
Module MemoryTotal Memory Bandwidth: 341 Gbps
HB-RAM:
AXI Bus Nb -:
PL - DDR4: 32 Gb
--32 bits:
--64 bits: 2x 64 bit bank
--ECC:
PS - DDR4:
FPGA FeaturesSystem Logic Cells (K): 726 kCell
DSP Slices: 2760 DSP
100G Ethernet MAC/PCS w/RS-FEC - 256 Gbps / instance:
PCIe Gen3 x16 /Gen4 x8 /CCIX- 256 Gbps / instance:
PCIe Gen3 x16 - 256 Gbps / instance: 3x PCIe
150G Interlaken - 256 Gbps / instance:
Video Codec 4K HEVC - 4K60p 422-10bits:
Embedded ProcessorQuad-ARM Processor - With GPU, RTU, 16GB eMMC:
PS-MIO Pins - 1,2 Gbps / IO:
PS-GTR - 6 Gbps / line:
On board ClockOn board Clock: 200MHz @ 30ppm
Mode: 300MHz @10ppm
Precision: /
Module ControlOn Board microcontroller:
Control - via microcontroller:
Monitoring:
Boot Mode: JTAG via FPGA
Boot Flash: Dual QSPI
Flash Memory - Total Capacity: 1 Gbit
Max NB of bitstream: 4 bit streams
On Board Security - Battery Powered: Real Time Clock Chip, FPGA Encyption Key
Power & Heat ManagementPower Consumption - Maximum: 35 W
Power Input: 12V (4.5A), 3.3V (0.5A)
Heatsink efficiency: 0.9 K/W
Operating Ambiant Temperature: Up to 65 °C
Physical FeaturesBare Module Size (mm):
Weight (bare): 73g
Module with Heatsink Size (mm): 93.75 x 52.6 x 32
Weight (with HeatSink): 230g

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